高等学校化学学报

高等学校化学学报

• 研究论文 • 上一篇    下一篇

电化学方法制备原子尺度间隙的Au隧道结过程研究

董晓东1,2, 张柏林1,2, 夏勇1,2, 朱果逸1,2   

    1. 中国科学院长春应用化学研究所, 电分析化学国家重点实验室, 长春 130022;
    2. 中国科学院研究生院, 北京 100049
  • 收稿日期:2007-11-05 修回日期:1900-01-01 出版日期:2008-07-10 发布日期:2008-07-10
  • 通讯作者: 张柏林

Process Investigation of the Electrochemical Fabrication of Au Tunnel Junction with Atomic-scale

DONG Xiao-Dong1,2, ZHANG Bai-Lin1,2* , XIA Yong1,2, ZHU Guo-Yi1,2   

    1. State Key Laboratory of Electroanalytical Chemistry, Changchun Institute of Applied Chemistry, Chinese Academy of Sciences, Changchun 130022, China;
    2. Graduate University of Chinese Academy of Sciences, Beijing 100049, China
  • Received:2007-11-05 Revised:1900-01-01 Online:2008-07-10 Published:2008-07-10
  • Contact: ZHANG Bai-Lin

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被引次数

8

摘要： 采用电化学方法制备了溶液中稳定的Au隧道结, 对制备过程中量子线到隧道结的整个实验过程进行了研究. 结果表明, 由于存在机械应力, 直接腐蚀Au丝很难精细控制电化学过程, 导致无法直接制得隧道结. 通过向溶液中加入氯金酸进一步电化学沉积/腐蚀成功地解决了此问题, 但溶液中Au离子的自沉积作用导致所形成的隧道结不稳定. 针对这一问题, 对实验过程进行了改进, 采用将腐蚀直接制得的电极对在盐酸溶液中定向电沉积的办法制备得到了溶液中稳定的Au隧道结.

关键词: 电化学制备, 量子线, 隧道结, 分子电子器件, 金

Abstract: A stable Au tunnel junction was fabricated electrochemically with the thin gold wire and the process was investigated in details. It is found that Au tunnel junction is not easy to be obtained by direct electrochemical etching of Au wire due to the mechanical stress. However, it’s easy to control the process of electrochemical deposition on a preformed Au electrode pair as well as its reverse process-etching with addition of chloiroauric acid in solution. The existence of Au ions may cause somewhat instability of the junction, while in hydrochloric acid solution, the process is under control and the Au tunnel junction is stable.

Key words: Electrochemical fabrication, Quantum wire, Tunnel junction, Molecular electron device, Au

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