Studies on Bonding Techniques for Poly(dimethylsiloxane) Microfluidic Chips

Abstract

Abstract: In this paper the procedure was discribed for enclosing PDMS substrate containing microstructures with a flat piece of PDMS cover plate to fabricate PDMS microfluidic chips. The effects of proportions of PDMS prepolymer and curing agent, curing temperature and time on the bonding strength of PDMS wafers were investigated. The optimal mass proportions were 10∶1 for substrate and 5∶1 for cover plate. The optimal curing time for substrate and cover plate was 35-50 min and 25-40 min, respectively, at 75 ℃. The surface of the substrate and that of the cover plate seal tightly and irreversibly when brought into close contact and continue cured for 60 min at 75 ℃. The chips have been used successfully for the separation of two FITC labeled amino acids and worked well within a period of six months with more than 50 cycles of operations involving solution loading in the channel and channel washing.

Key words: Poly(dimethylsiloxane)(PDMS), Microfluidic chip, Chip sealing

CLC Number:

O657

TrendMD:

YE Mei-Ying, FANG Qun, YIN Xue-Feng, FANG Zhao-Lun . Studies on Bonding Techniques for Poly(dimethylsiloxane) Microfluidic Chips[J]. Chem. J. Chinese Universities, 2002, 23(12): 2243.

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Studies on Bonding Techniques for Poly(dimethylsiloxane) Microfluidic Chips

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