Abstract: As a key representative of high-performance polymers, polyimide plays an irreplaceable role in strategic emerging fields such as integrated circuits, new energy, and aerospace, owing to its exceptional thermal resistance, outstanding mechanical properties, and remarkable dielectric characteristics. However, with the rapid development of cutting-edge areas such as flexible electronics, efficient energy conversion, and the “dual-carbon” strategy, traditional polyimide materials still face significant challenges in terms of dielectric properties, flexibility, functional integration, and thermal management. In response, this paper systematically reviews the innovative research achievements of our research group in multifunctional polyimides, focusing on five key dimensions: “core, screen, device/gas, integration.” Specifically, at the “core” level, material systems with ultra-low dielectric constants and high strength have been developed for advanced chip packaging. At the “screen” level, highly transparent and flexible films with excellent folding endurance have been fabricated to meet the demands of flexible displays. In the “device/gas” dimension, applications in energy devices and aerospace thermal management have been expanded, while structural designs have significantly enhanced gas separation performance, contributing to the “dual-carbon” goals. At the “integration” level, breakthroughs in thermal management capabilities of composites have been achieved by constructing multi-dimensional thermal conduction networks. This study not only demonstrates the considerable functional plasticity of polyimides but also provides important theoretical and technical support for addressing key material challenges in related scientific and technological fields.

Key words: Polyimide, High frequency with low dielectric constant, Film, Gas separation, Thermal management