Chem. J. Chinese Universities ›› 2022, Vol. 43 ›› Issue (8): 20220191.doi: 10.7503/cjcu20220191

• Physical Chemistry • Previous Articles     Next Articles

Effects of 5,5-Dimethylhydantoin on Electroless Copper Plating

ZHENG Anni, JIN Lei, YANG Jiaqiang, WANG Zhaoyun, LI Weiqing, YANG Fangzu(), ZHAN Dongping(), TIAN Zhongqun   

  1. College of Chemistry and Chemical Engineering,State Key Laboratory of Physical Chemistry of Solid Surface,Xiamen University,Xiamen 361005,China
  • Received:2022-03-27 Online:2022-08-10 Published:2022-05-24
  • Contact: YANG Fangzu,ZHAN Dongping E-mail:fzyang@xmu.edu.cn;dpzhan@xmu.edu.cn
  • Supported by:
    the National Natural Science Foundation of China(22132003)

Abstract:

In this paper, the effects of 5,5-dimethylhydantoin(DMH) on electroless copper plating were studied in the solution containing sodium potassium tartrate and disodium ethylene diamine tetraacetic acid as the complexing agents, and formaldehyde as the reducing agent. The experimental results of the electroless copper plating show that DMH can improve the stability of the bath. SEM and appearance images show that DMH can reduce the particle size of the copper coating and make the coating brighter and more compact. UV-Vis absorption spectra reveal that DMH does not strongly coordinate with Cu(II) in the bath. Linear voltammetry curves illuminate that DMH can inhibit the generation of Cu+ ions or promote the reduction of Cu+ ions, and reduce the oxidation rate of the formaldehyde during electroless copper plating. XRD patterns show that the copper coatings obtained from the baths both with and without DMH present the same face-centered cubic multi-crystal structures. No Cu2O diffraction peak is detected.

Key words: Electroless copper plating, Double complexing agents bath, 5, 5-Dimethylhydantoin, Bath stability

CLC Number: 

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