Chemical Journal of Chinese Universities ›› 2020, Vol. 41 ›› Issue (11): 2553-2560.doi: 10.7503/cjcu20200317

• Polymer Chemistry • Previous Articles    

Surface Modified Aramid Pulp with Polyaniline and Conductivity of Its Paper-based Materials

LING Xuxia1, LONG Zhu1,2(), WANG Shihua2,3, LI Zhiqiang2,3, GUO Shuai2,3, ZHANG Dan1   

  1. 1.Key Laboratory of Eco?Textiles,Ministry of Education,Jiangnan University,Wuxi 214122,China
    2.Lianyungang Fiber New Materials Research Institute Co. ,Ltd. ,Lianyungang 222002,China
    3.Lianyungang Industrial Investment Group Co. ,Ltd. ,Lianyungang 222002,China
  • Received:2020-06-01 Online:2020-11-10 Published:2020-11-06
  • Contact: LONG Zhu E-mail:longzhu@jiangnan.edu.cn
  • Supported by:
    Supported by the National Natural Science Foundation of China(31270633);the “555” Development Program of Lianyungang, China(2015?13)

Abstract:

PANI-AP was prepared by modifying polyaniline(PANI) on the surface of aramid pulp(AP), and then blended with carbon fiber to prepare paper-based material(PANI-AP/CP) with excellent electrical conductivity by wet papermaking technology. The morphology, conductivity and PANI distribution uniformity of PANI-AP/CP were characterized, and the effects of environmental humidity, temperature, pH, and storage time on the electrical conductivity of PANI-AP/CP were explored. The results showed that after PANI modification, the surface roughness and crystallinity of AP increased, and the appearance of diffraction peaks of conductive polyaniline containing quinone structure showed that polyaniline was successfully modified on aramid pulp. For the PANI-AP/CP prepared by this method, both the properties and the distribution uniformity were improved. Compared with the carbon fiber paper substrate (CP) and the AP/CP-PANI, the conductivity of PANI-AP/CP(3.937 S/cm) increased by 153.5% and 34.6%, respectively, and the average total color difference(DE) was reduced by 74.9% compared with AP/CP-PANI.

Key words: Polyaniline, Aramid pulp, Conductivity, Distribution uniformity

CLC Number: