Preparation and Properties of High Thermal Conductivity Hexagonal Boron Nitride/Aramid Fibrid Composite Film †

doi:10.7503/cjcu20190408

Abstract

Abstract:

To expand the application of aramid fibrid(AF) in the field of insulated and thermal conductive electronic devices, dopamine(DA) was used to modify the hexagonal boron nitride(h-BN) initially, which could oxidize self-polymerization under weak alkaline conditions and form the strong adhesive polydopamine(PDA). Then, the modified h-BN(h-BN@PDA) was used as the heat conductive filler to fill the AF matrix. Subsequently, h-BN@PDA/AF composite films were prepared by vacuum assisted filtration, and the microstructure, surface functional group, thermal conductivity, insulation properties and mechanical properties were also analyzed. The results showed that PDA was coated on the surface of h-BN, and plenty of active groups were introduced on the surface to form hydrogen bond with AF fiber. It was beneficial to increase the interfacial bonding and improve conductivity and insulation properties of composite films. When the h-BN@PDA mass fraction was 70%, thermal conductivity of h-BN@PDA/AF composite films could reach 1.36 W/(m·K), which increased by 697.65% compared to pure AF films. Additionally, the volume resistivity and tensile modulus of h-BN@PDA/AF composite films were 5.96×10 ¹⁴ Ω·m and 287.19 MPa, respectively.

Key words: Hexagonalboron nitride, Dopamine, Aramid fibrid, Insulation property, Thermal conductivity

CLC Number:

O634
O657

TrendMD:

XIE Fan,WANG Yafang,ZHUO Longhai,QIN Panliang,NING Doudou,WANG Danni,LU Zhaoqing. Preparation and Properties of High Thermal Conductivity Hexagonal Boron Nitride/Aramid Fibrid Composite Film ^†[J]. Chem. J. Chinese Universities, 2020, 41(3): 582.

Figures/Tables 11

Scheme 1 Schematic illustration of dopamine modified h-BN

Scheme 2 Schematic illustration of preparation process of h-BN@PDA/AF composite films

Fig.1 SEM images(A, B) and EDS analysis(C, D) of h-BN(A, C) and h-BN@PDA(B, D)

Fig.2 FTIR(A) and Raman(B) spectra of h-BN(a) and h-BN@PDA(b)

Fig.3 TG curves of h-BN(a) and h-BN@PDA(b)

Fig.4 SEM images of AF fibers(A), AF films(B), surface(C, D) and cross(E, F) sections of h-BN/AF(C, E) and h-BN@PDA/AF(D, F) composite films

Fig.5 FTIR spectra of AF films(a), h-BN/AF(b) and h-BN@PDA/AF(c) composite films

Fig.6 Thermal conductivity of h-BN/AF and h-BN@PDA/AF composite films

Scheme 3 Thermal conductivity mechanism of h-BN/AF and h-BN@PDA/AF composite films

Fig.7 Breakdown strength(A) and volume resistivity(B) of h-BN/AF and h-BN@PDA/AF composite films

Fig.8 Stress-strain curve(A), Young’s modulus(B), tensile index(C) and elongation(D) of h-BN/AF and h-BN@PDA/AF composite films In Fig.8(A), Ⅰ—Ⅴ refer to the h-BN/AF composite film with h-BN mass fraction of 0, 10%, 30%, 50% and 70%, respectively; ii—v refer to the h-BN@PDA/AF composite film with h-BN@PDA mass fraction of 10%, 30%, 50% and 70%, respectively.

References 34

[1]	Yang N., Wang N. Y., Yao Y. M. , Polymer Science and Engineering, 2017, 33( 1), 153— 157
	( 杨娜, 王农跃, 姚艳梅 . 高分子材料科学与工程, 2017, 33( 1), 153— 157)
[2]	Wu K., Fang J., Ma J ., ACS Applied Materials & Interfaces, 2017, 9( 35), 3004— 3035
[3]	Jia F. F., Xie F., Ning D. D ., China Pulp & Paper, 2019, 38( 5), 8— 13
	( 贾峰峰, 谢璠, 宁逗逗 . 中国造纸, 2019, 38( 5), 8— 13)
[4]	Wang W., Xia Y ., Insulation Materials, 2012, 45( 1), 19— 24
	( 王文, 夏宇 . 绝缘材料, 2012, 45( 1), 19— 24>)
[5]	Si J., Yang H ., Materials Chemistry & Physics, 2011, 128( 3), 519— 524
[6]	Postma A., Yan Y., Wang Y. J ., Chemistry of Materials, 2009, 21( 21), 3042— 3044
[7]	Zhou W. Y., Wang Z. J., Dong L. N. , Synthetic Resins and Plastics, 2015, 2, 80— 84
	( 周文英, 王子君, 董丽娜 . 合成树脂及塑料, 2015, 2, 80— 84)
[8]	Lu Z. Q., Jiang M., Zhang M. Y. , Paper Science and Technology, 2014, 4, 28— 33
	( 陆赵情, 江明, 张美云 . 造纸科学与技术, 2014, 4, 28— 33)
[9]	ZhaoY. S., Si L. M., Lu Z. Q ., Journal of Shaanxi University of Science and Technology, 2017, 35( 5), 1— 4
	( 赵永生, 司联蒙, 陆赵情 . 陕西科技大学学报, 2017, 35( 5), 1— 4)
[10]	Xie F., Zhang N., Zhuo L ., Composites Part B: Engineering, 2019, 168, 406— 412
[11]	Lu Z., Si L., Dang W ., Composites Part A: Applied Science and Manufacturing, 2018, 115, 321— 330
[12]	Zhao Y., Si L., Dang W ., Ceramics International, 2018, 44( 9), 10192— 10198
[13]	Chen L., Song H., Li Z. S ., Insulation Materials, 2018, 51(10), 7—10, 15
	( 陈磊, 宋欢, 李正胜 . 绝缘材料, 2018, 51(10), 7—10, 15)
[14]	Wu Y. M., Zhou W. Y ., Electronic Test, 2016, 19, 52— 56
	( 吴永明, 周文英 . 电子测试, 2016, 19, 52— 56)
[15]	Yasufuku S ., Electrical Insulation Magazine, 2002, 11( 6), 27— 33
[16]	Xu J. L., Wang C. C., Niu L ., Insulation Materials, 2016, 44( 8), 22— 26
	( 徐建林, 王程程, 牛磊 . 绝缘材料, 2016, 44( 8), 22— 26)
[17]	Yao Y., Zeng X., Sun R ., ACS Applied Materials & Interfaces, 2016, 8, 15645— 15653
[18]	Jiang X. F., Weng Q., Wang X. B ., Journal of Materials Science & Technology, 2015, 31( 6), 589— 598
[19]	Zhang R. C., Sun D., Lu A ., ACS Applied Materials & Interfaces, 2016, 8( 21), 13567— 13572
[20]	Yu B., Xing W., Guo W ., Journal of Materials Chemistry A, 2016, 4( 19), 7330— 7340
[21]	Wang T., Ou D., Liu H ., ACS Applied Nano Materials, 2018, 1( 4), 1705— 1712
[22]	Ji Y. C., Mao W. H., Liao H. J ., Chem. J. Chinese Universities, 2019, 40( 2), 216— 223
	( 吉钰纯, 毛文慧, 廖和杰 . 高等学校化学学报, 2019, 40( 2), 216— 223)
[23]	Zeng X., Yu S., Rong S ., Journal of Applied Polymer Science, 2013, 128( 3), 1353— 1359
[24]	Yu C., Zhang J., Li Z ., Composites Part A: Applied Science and Manufacturing, 2017, 98, 25— 31
[25]	Gu J., Meng X., Tang Y ., Composites Part A: Applied Science and Manufacturing, 2017, 92, 27— 32
[26]	Kuang Z., Chen Y., Lu Y ., Small, 2015, 11( 14), 1655— 1659
[27]	Feng C. P., Bai L., Bao R ., Advanced Composites & Hybrid Materials, 2018, 1( 1), 160— 167
[28]	Wang Z. Z., Yang T ., Chem. J. Chinese Universities, 2018, 39( 5), 1098— 1104
	( 王正洲, 杨婷 . 高等学校化学学报, 2018, 39( 5), 1098— 1104)
[29]	Borjas-Ramos., José J., Ramos-De-Valle L. F. , Plasma Chemistry and Plasma Processing, 2018, 38( 2), 429— 441
[30]	Ryu S., Kim K., Kim J ., Polymers for Advanced Technologies, 2017, 28( 11), 1489— 1494
[31]	Shen H., Guo J ., ACS Applied Materials & Interfaces, 2015, 7( 10), 5701— 5708
[32]	Wang X., Zhang Q., Cheng Y ., Journal of Controlled Release, 2015, 213, e122— e122
[33]	Shi C., Deng C., Zhang X., Yang P ., ACS Applied Materials & Interfaces, 2013, 5( 16), 7770— 7776
[34]	Thakur V. K., Yan J., Lin M. F ., Polymer Chemistry, 2012, 3( 4), 962— 969