Chem. J. Chinese Universities ›› 2004, Vol. 25 ›› Issue (9): 1756.

• Articles • Previous Articles     Next Articles

Curing Properties of an Epoxy Resin Containing Biphenyl Structure

ZHANG Chun-Ling1, NA Hui1, MU Jian-Xin1, YU Wen-Zhi2, FU Tie-Zhu ZHANG Xin-Gong1, LI Zi-Chuan1, WU Zhong-Wen1   

  1. 1. Alan G MacDiarmid Institiute;
    2. College of Chemistry, Jilin University, Changchun 130021, China
  • Received:2003-07-21 Online:2004-09-24 Published:2004-09-24

Abstract: A novel epoxy resin with biphenyl rings was synthesized with tetramethylbiphenol. In order to study the heat resistance and moisture absorption of this epoxy resin, two curing agents(DDM and DDS) were used. Compared to the bisphenol A epoxy resin, this novel epoxy resin has better heat resistance and its moisture resistance is improved, guite a lot also.

Key words: Biphenyl, Epoxy resin, Moisture absorption

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