Curing Reaction Kinetics of Epoxy Resin Containing Biphenyl Structure Using DDS as Curing Agent

Chem. J. Chinese Universities ›› 2004, Vol. 25 ›› Issue (10): 1937.

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Curing Reaction Kinetics of Epoxy Resin Containing Biphenyl Structure Using DDS as Curing Agent

ZHANG Chun-Ling^1,2, MU Jian-Xin¹, YU Wen-Zhi¹, MI Xin-Yan¹, FU Tie-Zhu¹, PANG Jian-Xun¹, NA Hui¹, WU Zhong-Wen¹

1. College of Chemistry, Changchun 130021, China;
2. College of Materials Science and Engineering, Jilin University, Changchun 130021, China

Received:2003-10-08 Online:2004-10-24 Published:2004-10-24

Abstract

CLC Number:

O631

TrendMD:

ZHANG Chun-Ling, MU Jian-Xin, YU Wen-Zhi, MI Xin-Yan, FU Tie-Zhu, PANG Jian-Xun, NA Hui, WU Zhong-Wen . Curing Reaction Kinetics of Epoxy Resin Containing Biphenyl Structure Using DDS as Curing Agent[J]. Chem. J. Chinese Universities, 2004, 25(10): 1937.

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Curing Reaction Kinetics of Epoxy Resin Containing Biphenyl Structure Using DDS as Curing Agent

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