高等学校化学学报 ›› 2012, Vol. 33 ›› Issue (07): 1591-1594.doi: 10.3969/j.issn.0251-0790.2012.07.040

• 高分子化学 • 上一篇    下一篇

高热稳定性氟化聚酰亚胺的合成及在热光开关中的应用

靳琳1, 刘禹2, 曹子谏1, 孟杰1, 姜振华2, 张大明1   

  1. 1. 集成光电子学国家联合实验室吉林大学试验区, 吉林大学电子科学与工程学院, 长春 130012;
    2. 吉林大学化学学院, 麦克德尔米德实验室, 长春 130012
  • 收稿日期:2011-09-05 出版日期:2012-07-10 发布日期:2012-07-10
  • 通讯作者: 张大明, 男, 博士, 教授, 主要从事聚合物光子学和聚合物平面光波回路研究. E-mail: zhangdm@jlu.edu.cn E-mail:zhangdm@jlu.edu.cn
  • 基金资助:

    国家自然科学基金(批准号: 61107019, 61177027, 61077041和60807029)、 吉林省青年科研基金(批准号: 20100174)、 吉林省科技发展计划工业高新技术重点项目(批准号: 20110315)和吉林大学基本科研业务费(批准号: 201103071, 201100253和200905005)资助.

Synthesis of Fluorinated Polyimide with High Thermal Stability and Its Application for Thermo-optic Switch

JIN Lin1, LIU Yu2, CAO Zi-Jian1, MENG Jie1, JIANG Zhen-Hua2, ZHANG Da-Ming1   

  1. 1. State Key Laboratory on Integrated Optoelectronics, College of Electronic Science and Engineering, Jilin University, Changchun 130012, China;
    2. Alan G.MacDiarmid Institute, College of Chemistry, Jilin University, Changchun 130012, China
  • Received:2011-09-05 Online:2012-07-10 Published:2012-07-10

摘要: 用一种新型超支化氟化聚酰亚胺(FHBPI)作为波导材料制备了聚合物热光开关. 采用DSC, TGA, 近红外吸收谱和原子力显微镜(AFM)等方法对FHBPI的热稳定性及光学特性进行了表征. 结果显示, FHBPI的玻璃化转变温度为189 ℃, 在空气中5%的热失重温度为596 ℃, 表明具有良好的热稳定性; 旋转涂膜法制备的FHBPI薄膜具有良好的成膜性; 薄膜表面粗糙度为0.54 nm; FHBPI在光通信波段有较小的吸收损耗, 适合制备低损耗的光波导器件; 用FHBPI-50为波导芯层材料, FHBPI-30为包层材料, 设计制作的热光开关响应上升时间为267.9 μs, 下降时间为254.1 μs.

关键词: 超支化氟化聚酰亚胺, 热光开关, 器件, 热稳定性

Abstract: A novel material fluorinated hyper branched polyimide(FHBPI) was synthesized for using in thermo-optic waveguide switch applications. This material has high thermal stability. Differential scanning calorimeter(DSC) and thermo-gravimetric analysis(TGA) were taken to evaluate the glass transition temperature(Tg) and the thermal decomposition temperature(Td,5%). The results indicate that Tg and Td,5% are 189 and 596 ℃, respectively. The film quality of FHBPI is excellent. The atomic force microscopy(AFM) exhibits the surface roughness of FHBPI film, which is 0.54 nm. FHBPI has a high optical transparency in the infrared communication region. The thermo-optic switch device was designed, fabricated and tested by FHBPI. The rise time and fall time of the switch are 267.9 and 254.1 μs, respectively.

Key words: Fluorinated hyper branched polyimide, Thermo-optic switch, Device, Thermal stability

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