Chem. J. Chinese Universities ›› 2004, Vol. 25 ›› Issue (S1): 52.

• Articles • Previous Articles     Next Articles

Finite Element Simulation of Temperature Field of Hot Embossing of Polymeric Microfluidic Chip

FU Jian-Zhong, HE Yong, CHEN Zi-Chen   

  1. Department of mechanical engineering, Microsystem research and development center, Zhejiang University, Hangzhou 310028/310027, China
  • Online:2004-12-31 Published:2004-12-31

Key words: Microfluidic chip, Polymer, Hot embossing, Finite element simulation

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