Chem. J. Chinese Universities ›› 1993, Vol. 14 ›› Issue (5): 706.

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Study of Copper Electrodeposition on HOPG by in Situ Electrochemical Scanning Tunneling Microscope with Atomic Resolution

LI Chun-Zeng, XIE Zhao-Xiong, MAO Bing-Wei, ZHUO Xiang-Dong, MU Ji-Qian, YE Jian-Hui, FENG Zu-De, TIAN Zhao-Wu   

  1. Deft, of Chem., Slate Key Lab.for Physical Chem.of the Solid Surface, Xiamen Univ., Xiamen, 361005
  • Received:1992-11-19 Online:1993-05-24 Published:1993-05-24

Abstract: Ahome-built in situ electrochemical scanning tunneling microscope (ECSTM) was applied to investigation of the electrodeposition of Cu on HOPGin CuSO4 solution under potential control.During potential cycling, the deposition and dissolution processes of Cu were clearly observed.At about-250 mV(vs.Cu2+/Cu) it was found that the STMimages changed with time.Aregular hexagonal lattice was observed first, with a next-neighbour atomic distance of 0.40±0.02 nm, which is considered to be HOPG(0001)-(√3×√3)R30° Cu adlattice.Following that, Cu(111) and Cu(110) faces appeared, both showing long range-corrugation patterns.

Key words: ECSTM, Atomic resolution, Cu, Electrodeposition, Adlattice

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