高等学校化学学报 ›› 2013, Vol. 34 ›› Issue (3): 739.doi: 10.7503/cjcu20120526

• 高分子化学 • 上一篇    下一篇

新型抑菌Cu2+固载超滤膜的制备及性能表征

陈培培1, 徐佳1, 蒋钰烨1, 冯晨晨1, 高从堦1,2   

  1. 1. 中国海洋大学化学化工学院, 海洋化学理论与工程技术教育部重点实验室, 青岛 266100;
    2. 杭州水处理技术研究开发中心, 杭州 310000
  • 收稿日期:2012-05-30 出版日期:2013-03-10 发布日期:2013-02-18
  • 通讯作者: 高从堦,男,教授,博士生导师,院士,主要从事膜法水处理技术研究.E-mail:gaocjie@mail.hz.zj.cn;徐佳,女,博士,讲师,主要从事膜制备和膜法海水淡化预处理过程研究.E-mail:jiapipi2@163.com E-mail:gaocjie@mail.hz.zj.cn;jiapipi2@163.com
  • 基金资助:

    国家"九七三"计划项目(批准号:2009CB623402)\,山东省优秀中青年科学家科研奖励基金(批准号:BS2012HZ016)和山东省科技发展计划项目(批准号:2012GGE29033)资助.

Preparation and Characterization of a Novel Anti-biofouling Ultrafiltration Membrane with Cu2+ Immobilization

CHEN Pei-Pei1, XU Jia1, JIANG Yu-Ye1, FENG Chen-Chen1, GAO Cong-Jie1,2   

  1. 1. College of Chemistry and Chemical Engineering, Key Laboratory of Marine Chemistry Theory and Technology, Ministry of Education, Ocean University of China, Qingdao 266100, China;
    2. Hangzhou Water Treatment Technology Development Center, Hangzhou 310000, China
  • Received:2012-05-30 Online:2013-03-10 Published:2013-02-18

摘要:

将聚乙烯亚胺(PEI)通过静电作用自组装于聚丙烯腈(PAN)多孔基膜表面, 形成高分子聚电解质层; 进一步通过浸泡法和动态电沉积法, 将Cu2+固载于高分子聚电解质层上, 制备出新型Cu2+固载超滤膜. 研究结果表明, Cu2+固载超滤膜的PEI层和Cu2+均具有较高稳定性; 该分离膜对腐植酸的截留率高达99.0%, 且具有优良的抑菌性能, 抑菌率高达85.7%. 此外, 相对于静态浸泡法, 动态电沉积法是一种更有效的Cu2+固载手段, 不仅大幅缩短了固载时间, 还显著提高了Cu2+固载率.

关键词: 超滤膜, 聚乙烯亚胺, 电沉积, 铜固载, 抑菌性

Abstract:

Polyethylenimine(PEI) polyelectrolyte layer was firstly formed on a polyacrylonitrile(PAN) substrate. Copper(Ⅱ) ions were immobilized onto the PEI layer via two different approaches for the anti-biofou-ling membrane preparation, including static immersion and dynamic electro-deposition. Finally, a novel ultrafiltration membrane with Cu2+ immobilization was obtained. The results indicated that both the PEI layer and Cu2+ on the resulting membrane had relatively high stability. The rejection rate to humic acid of this membrane up to 99.0%, and this membrane also had an excellent bacteriostatic property, the bacteriostasis rate was 85.7%. In addition, compared to the static immersion method, dynamic electro-deposition method was a much more effective method for immobilizing Cu2+, which could reduce the Cu2+ immobilization time and significantly improve the immobilization efficiency.

Key words: Ultrafiltration membrane, Polyethylenimine, Electro-deposition, Copper(Ⅱ) immobilization, Bacteriostasis

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