高等学校化学学报 ›› 2000, Vol. 21 ›› Issue (4): 586.

• 论文 • 上一篇    下一篇

2-烷基苯并咪唑在铜表面所成膜热稳定性能的研究

史子兴, 庞正智   

  1. 北京化工大学材料科学与工程学院, 北京 100029
  • 收稿日期:1999-03-09 出版日期:2000-04-24 发布日期:2000-04-24
  • 通讯作者: 史子兴(1972年出生),男,博士研究生,从事功能高分子方面的研究.
  • 基金资助:

    国防化工重点科研项目资助

An Investigation of the Thermal Stability of 2-Alkylbenzoimidazole on Copper

SHI Zi-Xing, PANG Zheng-Zhi   

  1. College of Materials Science & Engineering, Beijing University of Chemical Technology, Beijing 100029, China
  • Received:1999-03-09 Online:2000-04-24 Published:2000-04-24

摘要: 分别测定了2-烷基苯并咪唑在铜表面所成膜经150,200,250℃热处理后的FTIR谱,对膜的结构和热稳定性能进行了研究.结果表明,2-烷基苯并咪唑与铜发生了络合反应,并在铜表面形成膜,其热稳定性随2位烷基碳链的增长而减弱;由于独特的稠环结构,与2-烷基咪唑相比,热稳定性能增强.

关键词: 2-烷基苯并咪唑, 热处理, 热稳定性

Abstract: Accumulating on copper surface very guickly in agueous solution, 2-alkylbenzimidazole is an ideal inhibitor and anti corrosion chemical for copper. In this paper, the thermal stability of 2-alkylbenzoimidazoles on copper, which have been treated at 150, 200 and 250 ℃ respectively, has been studied by FTIR. It is indicated that 2-alkylbenzoimidazole on copper has a poor thermal stability as the chain length of alkyl substituent increased, compared with that of 2-alkylimidazoles on copper, the thermal stability of 2-alkylbenzoimidazoles was improved due to their special molecular structure.

Key words: 2-Alkylbenzoimidazole, Heat treatment, Thermal stability

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