Preparation of Antistatic and Flame Retarding Material by Polypropylene Composites Filled with Conductive Polyacenic Semiconductor Material

Chem. J. Chinese Universities

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Preparation of Antistatic and Flame Retarding Material by Polypropylene Composites Filled with Conductive Polyacenic Semiconductor Material

LIN Lin, WANG Cun-Guo*, ZHANG Ping, YANG Lei, XIAO Hong-Jie, LI Bing-Hai, LI Da-Peng, ZHAO Qiang

Key Laboratory of Rubber-plastics(Qingdao University of Science and Technology), Ministry of Education, Qingdao 266042, China

Received:2007-09-28 Revised:1900-01-01 Online:2008-06-10 Published:2008-06-10
Contact: WANG Cun-Guo

Abstract

Abstract: Nano-particles of polyacenic semiconductor material(PAS) were used as a novel filler instead of carbon black and graphite to prepare PAS/polypropylene(PP) composite, which has antistatic and flame retarding properties. The percolation threshold of PAS/PP composites was confirmed and the phenomenon of percolation threshold was investigated. The effects of content of PAS in the composite on volume resistivity and surface resistivity were discussed in detail. The result of resistivity test shows that the composites were in percolation threshold, when the mass fraction of PAS was between 16.7% and 28.6%. When the mass fraction was 28.6%, the volume resistivity decreased to 2.09×10⁷ Ω·cm. In addition, flame-retarding property was studied too. Experimental result shows that PAS/PP composites could flame out after ignition in the air when the mass fraction of PAS was more than 23.1%.

Key words: Nano-particle of polyacenic semiconductor material, Polypropylene, Resistivity, Antistatic pro-perty, Flame retarding property

CLC Number:

O631.2

TrendMD:

LIN Lin, WANG Cun-Guo*, ZHANG Ping, YANG Lei, XIAO Hong-Jie, LI Bing-Hai, LI Da-Peng, ZHAO Qiang. Preparation of Antistatic and Flame Retarding Material by Polypropylene Composites Filled with Conductive Polyacenic Semiconductor Material[J]. Chem. J. Chinese Universities, doi: .

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Preparation of Antistatic and Flame Retarding Material by Polypropylene Composites Filled with Conductive Polyacenic Semiconductor Material

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