高导热氮化硼/芳纶沉析复合薄膜的制备及性能

doi:10.7503/cjcu20190408

高等学校化学学报 ›› 2020, Vol. 41 ›› Issue (3): 582.doi: 10.7503/cjcu20190408

• 高分子化学 • 上一篇

高导热氮化硼/芳纶沉析复合薄膜的制备及性能

谢璠,王亚芳,卓龙海,秦盼亮,宁逗逗,王丹妮,陆赵情

陕西科技大学轻工科学与工程学院, 陕西省造纸技术及特种纸品开发重点实验室, 轻化工程国家级实验教学示范中心, 中国轻工业纸基功能材料重点实验室, 轻化工助剂化学与技术协同创新中心, 西安 710021

收稿日期:2019-07-22 出版日期:2020-01-15 发布日期:2019-12-31
通讯作者: 陆赵情
作者简介:陆赵情, 男, 博士, 教授, 主要从事高性能纸基功能材料研究. E-mail: luzhaoqing302@163.com
基金资助:
国家自然科学基金(No.51803110);国家重点研发计划项目(Nos.2017YFB0308300);国家重点研发计划项目(Nos.2017YFB0308302);陕西省自然科学基础研究计划(No.2019JQ-010);陕西省重点科技创新团队计划资助(No.2017KCT-02)

Preparation and Properties of High Thermal Conductivity Hexagonal Boron Nitride/Aramid Fibrid Composite Film ^†

XIE Fan,WANG Yafang,ZHUO Longhai,QIN Panliang,NING Doudou,WANG Danni,LU Zhaoqing

College of Bioresources Chemical and Materials Engineering, Shaanxi Province Key Laboratory of Paper-making Technology and Specialty Paper, National Demonstration Center for Experimental Light Chemistry Engineering Education, Key Laboratory of Paper Based Functional Materials of China National Light Industry, Shaanxi Collaborative Innovation Center of Industrial Auxiliary Chemistry and Technology, Shaanxi University of Science & Technology, Xi’an 710021, China

Received:2019-07-22 Online:2020-01-15 Published:2019-12-31
Contact: Zhaoqing LU
Supported by:
† Supported by the National Natural Science Foundation of China(No.51803110);the National Key Research and Development Plan, China(Nos.2017YFB0308300);the National Key Research and Development Plan, China(Nos.2017YFB0308302);the Shaanxi Natural Science Basic Research Program, China(No.2019JQ-010);the Shaanxi Province Supporting Plan for Innovative Research, China(No.2017KCT-02)

摘要/Abstract

摘要：

利用多巴胺(DA)的氧化自聚合特性, 对六方氮化硼(h-BN)进行表面修饰, 并以多巴胺改性后的氮化硼(h-BN@PDA)为导热填料, 对基体芳纶沉析纤维(AF)进行填充, 通过真空辅助抽滤法制备多巴胺改性氮化硼/芳纶沉析(h-BN@PDA/AF)复合薄膜, 并对其微观形貌、表面官能团、导热性能、绝缘性能及力学性能进行研究. 结果表明, 聚多巴胺(PDA)包覆在h-BN表面, 并引入活性基团, 与AF纤维产生氢键, 改善了两者的界面结合, 显著提高了复合薄膜导热性能及绝缘性能. 当h-BN@PDA含量为70%时, h-BN@PDA/AF复合薄膜的导热系数为1.36 W/(m·K), 与纯芳纶沉析薄膜相比, 导热系数的增幅约为697.65%, 体积电阻率为5.96×10 ¹⁴ Ω·m, 拉伸模量高达287.19 MPa.

关键词: 氮化硼, 多巴胺, 芳纶沉析, 绝缘性能, 导热性能

Abstract:

To expand the application of aramid fibrid(AF) in the field of insulated and thermal conductive electronic devices, dopamine(DA) was used to modify the hexagonal boron nitride(h-BN) initially, which could oxidize self-polymerization under weak alkaline conditions and form the strong adhesive polydopamine(PDA). Then, the modified h-BN(h-BN@PDA) was used as the heat conductive filler to fill the AF matrix. Subsequently, h-BN@PDA/AF composite films were prepared by vacuum assisted filtration, and the microstructure, surface functional group, thermal conductivity, insulation properties and mechanical properties were also analyzed. The results showed that PDA was coated on the surface of h-BN, and plenty of active groups were introduced on the surface to form hydrogen bond with AF fiber. It was beneficial to increase the interfacial bonding and improve conductivity and insulation properties of composite films. When the h-BN@PDA mass fraction was 70%, thermal conductivity of h-BN@PDA/AF composite films could reach 1.36 W/(m·K), which increased by 697.65% compared to pure AF films. Additionally, the volume resistivity and tensile modulus of h-BN@PDA/AF composite films were 5.96×10 ¹⁴ Ω·m and 287.19 MPa, respectively.

Key words: Hexagonalboron nitride, Dopamine, Aramid fibrid, Insulation property, Thermal conductivity

中图分类号:

O634
O657

TrendMD:

谢璠,王亚芳,卓龙海,秦盼亮,宁逗逗,王丹妮,陆赵情. 高导热氮化硼/芳纶沉析复合薄膜的制备及性能. 高等学校化学学报, 2020, 41(3): 582.

XIE Fan,WANG Yafang,ZHUO Longhai,QIN Panliang,NING Doudou,WANG Danni,LU Zhaoqing. Preparation and Properties of High Thermal Conductivity Hexagonal Boron Nitride/Aramid Fibrid Composite Film ^†. Chem. J. Chinese Universities, 2020, 41(3): 582.

图/表 11

Scheme 1 Schematic illustration of dopamine modified h-BN

Scheme 2 Schematic illustration of preparation process of h-BN@PDA/AF composite films

Fig.1 SEM images(A, B) and EDS analysis(C, D) of h-BN(A, C) and h-BN@PDA(B, D)

Fig.2 FTIR(A) and Raman(B) spectra of h-BN(a) and h-BN@PDA(b)

Fig.3 TG curves of h-BN(a) and h-BN@PDA(b)

Fig.4 SEM images of AF fibers(A), AF films(B), surface(C, D) and cross(E, F) sections of h-BN/AF(C, E) and h-BN@PDA/AF(D, F) composite films

Fig.5 FTIR spectra of AF films(a), h-BN/AF(b) and h-BN@PDA/AF(c) composite films

Fig.6 Thermal conductivity of h-BN/AF and h-BN@PDA/AF composite films

Scheme 3 Thermal conductivity mechanism of h-BN/AF and h-BN@PDA/AF composite films

Fig.7 Breakdown strength(A) and volume resistivity(B) of h-BN/AF and h-BN@PDA/AF composite films

Fig.8 Stress-strain curve(A), Young’s modulus(B), tensile index(C) and elongation(D) of h-BN/AF and h-BN@PDA/AF composite films In Fig.8(A), Ⅰ—Ⅴ refer to the h-BN/AF composite film with h-BN mass fraction of 0, 10%, 30%, 50% and 70%, respectively; ii—v refer to the h-BN@PDA/AF composite film with h-BN@PDA mass fraction of 10%, 30%, 50% and 70%, respectively.

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高导热氮化硼/芳纶沉析复合薄膜的制备及性能

Preparation and Properties of High Thermal Conductivity Hexagonal Boron Nitride/Aramid Fibrid Composite Film ^†

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高导热氮化硼/芳纶沉析复合薄膜的制备及性能

Preparation and Properties of High Thermal Conductivity Hexagonal Boron Nitride/Aramid Fibrid Composite Film †

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Preparation and Properties of High Thermal Conductivity Hexagonal Boron Nitride/Aramid Fibrid Composite Film ^†