高等学校化学学报

高等学校化学学报 ›› 1988, Vol. 9 ›› Issue (4): 358.

• 论文 • 上一篇    下一篇

电镀渗氢的数学模型

吴辉煌, 周绍民   

  1. 厦门大学化学系
  • 收稿日期:1986-12-05 出版日期:1988-04-24 发布日期:1988-04-24
  • 通讯作者: 吴辉煌
  • 基金资助:

    中国科学院科学基金

Mathematical Modeling of Hydrogen Permeation in Electroplating

Wu Huihuang, Zhou Shaomin   

  1. Chemistry Department, Xiamen University, Xiamen
  • Received:1986-12-05 Online:1988-04-24 Published:1988-04-24

PDF (PC)

被引次数

4

摘要： 提出电镀中渗氢的新数学模型,导出渗氢电流暂态关系式,并用于解释文献中的实验结果。对渗氢电流曲线的分类以及渗氢物理参数的测定进行了讨论。

关键词: 渗氢, 金属-氢体系, 氢损伤, 电镀

Abstract: Anew mathematical model is presented for hydrogen permeation in electroplating. The equations for the permeation-current transients are derived, and used to illustrate the observations in the literature. The traditional classification of the permeation-current curves and the determination of physical parameters are discussed.

Key words: Hydrogen permeation, Hydrogen-metal system, Hydrogen damage, Electroplating

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