Chem. J. Chinese Universities ›› 2021, Vol. 42 ›› Issue (6): 1978.doi: 10.7503/cjcu20200829

• Polymer Chemistry • Previous Articles     Next Articles

Synthesis and Properties of Polyimide Resin Containing Acetylene and Benzoxazine Double Crosslinking Moieties

WU Tao, FANG Yuting, DONG Jie(), ZHAO Xin, ZHANG Qinghua   

  1. State Key Laboratory Modification of Fiber Material and Polymer Materials,College of Materials Science and Engineering,Donghua University,Shanghai 201620,China
  • Received:2020-11-25 Online:2021-06-10 Published:2021-06-08
  • Contact: DONG Jie
  • Supported by:
    the National Natural Science Foundation of China(1903038)


To develop high-performance polyimide resins that can be cross-linked at a relative low temperature, a novel polyimide resin(PIBzA) was designed and synthesized by introducing the benzoxazine ring into the acetylene-terminated polyimide oligomer. During the curing process, a ring-opening polymerization of benzoxazine and cross-linking of acetylene take place in the oligomer, and a novel double cross-linked network can be formed in the cured resin. Interestingly, an approximately 32 ℃ lower in curing temperature can be observed for this polyimide resin compared with the sample without the benzoxazine moiety. Meanwhile, the introduction of benzoxazine moiety does not destroy the excellent thermal resistance of polyimide resin, and the glass transition temperature(Tg) of the cured PIBzA resin ranges from 266 to 290 ℃, and the 5% mass loss temperature is close to 500 ℃. Meanwhile, the cured PIBzA resin shows relative low dielectric constants of 2.3―3.0 and low dielectric loss of 0.002―0.008, which can meet the requirements of wave-transparent composites and advanced microelectronic packaging materials.

Key words: Polyimide resin, Benzoxazine, Acetylene-terminated, Low-temperature curing, High-temperature resistance

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