Mechanisms and Electrochemical Properties of Different Stabilizers in Stannous Methanesulfonate Solution†

doi:10.7503/cjcu20180072

Abstract

Abstract:

The effects of hydroquinone, catechol, resorcinol and ascorbic acid on the stability of stannous methanesulfonate plating bath, electrochemical properties and the surface morphology of the tin coating were investigated. And the relationship between the stability of the plating solution and the reducibility and electrochemical activity of the stabilizer was explored by cyclic voltammograms. The influence of stabilizer on the cathodic polarization performance of the bath was investigated by alternating current(AC) impedance and chronopotentiometry. The principle of cyclic application of hydroquinone in electroplating process and the optimal concentration of hydroquinone were studied. The results show that there is an important relationship between the stability of the plating solution and the reduction ability and electrochemical activity of the stabilizer. The stability of the four stabilizers on the bath is in the order of magnitude: hydroquinone>catechol>ascorbic acid>resorcinol, and hydroquinone, the best stabilizer, can double the storage time of the plating solution. Phenolic stabilizers can increase the degree of cathodic polarization of tin deposition and refine the grains, while ascorbic acid has a depolarization effect on the deposition of tin. Hydroquinone plays a role of antioxidant, brightener and leveler in the tin electroplating process. The corrosion resistance of the coating shows that the optimum concentration of hydroquinone is 1.0 g/L.

Key words: Electroplating tin, Stannous methylsulfonate, Stabilizer, Bath stability

CLC Number:

O646

TrendMD:

WANG Chaonan, LU Haiyan, HUANG Weimin, LI Xiangzhong, LIN Haibo. Mechanisms and Electrochemical Properties of Different Stabilizers in Stannous Methanesulfonate Solution^†[J]. Chem. J. Chinese Universities, 2018, 39(8): 1768.

Figures/Tables 6

Fig.1 Bath cloudy time(A), consumption volume of H2O2 by 100 mL bath(B) and the change of bath appearance with storage time(C)a. Basic solution; b. basic solution+resorcinol; c. basic solution+ascorbic acid; d. basic solution+catechol; e. basic solution+hydroquinone.

Fig.2 Cyclic voltammograms of stabilizer in NaOH and CH3SO3Ha. Hydroquinone; b. catechol; c. ascorbic acid;d. resorcinol.

Fig.3 Chronopotentiometric curves at current density of 2 mA/cm2(A) and Nyquist plots at -0.46 V(vs. SCE)(B) of plating baths with and without stabilizersa. Basic solution+ascorbic acid; b. basic solution; c. basic solution+hydroquinone; d. basic solution+resorcinol; e. basic solution+catechol.

Fig.4 SEM images of tin coating deposited from solutions with and without stabilizers(A, A') Basic solution; (B, B') basic solution+hydroquinone; (C, C') basic solution+catechol;(D, D') basic solution+resorcinol; (E, E') basic solution+ascorbic acid.

Fig.5 Cyclic voltammograms of hydroquinone in NaOH and CH3SO3H solution for 10 cycles(A), depen-dence of consumption volume of H2O2 on hydroquinone concentration(B) and cathodic polarization curves(scan rate: 1 mV/s) on the Cu substrate in the plating bath with different hydroquinone concentrations(C)c(HQ)/(g·L-1): a. 0; b. 0.5; c. 1.0.

Fig.6 Polarization curves of tin coatings deposited from the baths with different concentrations of hydroquinone in 3.5% NaCl solution(A) and dependence of Ecorr and Icorr of tin coatings on hydroquinone concentration(B)c(HQ)/(g·L-1): a. 0; b. 0.5; c. 1.0; d. 1.5.

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