高等学校化学学报 ›› 2013, Vol. 34 ›› Issue (12): 2778.doi: 10.7503/cjcu20130842

• 物理化学 • 上一篇    下一篇

低黏附耐酸碱水相超疏油铜表面的制备

成中军1,2, 来华1,2, 付珂玮1,2, 张乃庆1,2, 孙克宁1,2   

  1. 1. 哈尔滨工业大学基础与交叉科学研究院, 哈尔滨 150001;
    2. 哈尔滨工业大学化学与能源材料研究所, 哈尔滨 150001
  • 收稿日期:2013-08-30 出版日期:2013-12-10 发布日期:2013-11-25
  • 作者简介:孙克宁,男,博士,教授,主要从事电化学方面的研究. E-mail:keningsunhit@163.com
  • 基金资助:

    国家自然科学基金(批准号:21304025);高等学校博士学科点专项科研基金(批准号:20112302120062)和哈尔滨工业大学科研创新基金(批准号:HIT.NSRIF.2009079)资助.

Fabrication of Superoleophobic Copper Surfaces with Low Adhesion and Acid/basic-resistance in Water

CHENG Zhong-Jun1,2, LAI Hua1,2, FU Ke-Wei1,2, ZHANG Nai-Qing1,2, SUN Ke-Ning1,2   

  1. 1. Academy of Fundamental and Interdisciplinary Sciences, Harbin Institute of Technology, Harbin 150001, China;
    2. Institute of Chemistry and Energy Materials, Harbin Institute of Technology, Harbin 150001, China
  • Received:2013-08-30 Online:2013-12-10 Published:2013-11-25

摘要:

制备了一种新型的耐酸碱性的水相超疏油铜表面. 在水相中,油滴在其表面上的接触角高达162°,同时极易滚动,表明所得到的表面不但具有水相超疏油特性,同时还表现出较低的黏附性及较强的耐酸碱能力. 在不同pH值(2~12)的水溶液中,这种低黏附超疏油特性依然存在. 研究表明,该表面的水下超疏油及低黏附特性主要源于表面亲水性的化学组成及独特的微纳米等级结构之间的协同作用. 而较强的耐酸碱性则得益于铜材料自身较好的化学稳定性.

关键词: 水下, 超疏油, 低黏附, 耐酸碱性, 铜表面材料

Abstract:

A novel superoleophobic copper surface in water with special acid/basic resistant property was reported. When the surface is placed under water, an oil droplet has a high contact angle of about 162°, indicating that the surface is superoleophobic in water. Meanwhile, the surface is low adhesive to the oil droplet, and an oil droplet can roll on the surface easily with a sliding angle of about 3°. Noticeably, the surface has a special acid/basic-resistant property and can retain the low adhesive superoleophobic performance at various pH values(2—12) in water. The low adhesive superoleophobic property in water can be ascribed to the combined effect of the hydrophilicity and the hierarchical structures on the surface, and the acid/basic-resis-tance is due to the chemical stability of copper substrate.

Key words: In water, Superoleophobicity, Low adhesion, Acid/basic-resistance, Copper surface material

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