高等学校化学学报 ›› 2009, Vol. 30 ›› Issue (11): 2297.

• 研究论文 • 上一篇    下一篇

用于树脂传递模塑成型的苯乙炔封端的酰亚胺预聚体制备

于晓慧1, 赵晓刚1, 刘长威1, 党国栋1, 王运良1,2, 周宏伟1   

  1. 1. 吉林大学麦克德尔米德实验室, 长春 130012;
    2. 佳木斯大学化学与药学学院, 佳木斯 154007
  • 收稿日期:2009-03-31 出版日期:2009-11-10 发布日期:2009-11-10
  • 通讯作者: 周宏伟, 女, 博士, 教授, 主要从事聚酰亚胺的研究. E-mail: zhw@email.jlu.edu.cn
  • 基金资助:

    吉林省科技厅科技支撑项目(批准号: 20086023)资助.

Preparation of Resin Transfer Moldable Phenylethyl-terminated Imide Oligomers

YU Xiao-Hui1, ZHAO Xiao-Gang1, LIU Chang-Wei1, DANG Guo-Dong1, WANG Yun-Liang1,2, ZHOU Hong-Wei1*   

  1. 1. Alan G. MacDiarmid Institute, Jilin University, Changchun 130012, China;
    2. Chemical & Pharmaceutical College Jiamusi University, Jiamusi 154007, China
  • Received:2009-03-31 Online:2009-11-10 Published:2009-11-10
  • Contact: ZHOU Hong-Wei. E-mail: zhw@email.jlu.edu.cn
  • Supported by:

    吉林省科技厅科技支撑项目(批准号: 20086023)资助.

摘要:

采用4-苯乙炔苯酐(4-PEPA)、1,3-二(3-氨基苯氧基-4′-苯酰基)苯(BABB)和4,4′-双(3-氨基苯氧基)二苯甲酮(APBP)合成了两种苯乙炔苯酐封端的聚酰亚胺预聚体PI-1和PI-2, 并对预聚体的熔体黏度、稳定性、固化后树脂的热稳定性能和机械性能等进行了研究. 结果表明, 制备的预聚体具有较高产率(>95%); 与其它PEPA封端的聚酰亚胺相比, 两种预聚物在较低温度(200 ℃)时均具有很低的熔体黏度(1 Pa·s)和良好的熔体黏度稳定性, 固化后玻璃化温度达到300 ℃以上, 可适用于树脂传递模塑(RTM)成型制备耐高温高性能树脂基复合材料, 且在成型工艺上有了很大改善; 固化后的树脂具有优异的热稳定性能和良好的机械性能.

关键词: 聚酰亚胺; 预聚体; 苯乙炔封端

Abstract:

Two kinds of novel phenylethynyl terminated imide oligomers were prepared with BABB, APBP and PEPA. The melt viscosity stability of the oligomers and thermal stability, mechanical properties of cured resins were studied in this paper. The results show that the oligomers can be used to prepare the high perfor-mance resin-based composite materials via resin transfer molding(RTM) due to their low melt viscosities(about 1 Pa·s) and excellent stability at 200 ℃. The cured resins exhibit excellent thermal stability and mechanical properties.

Key words: Polyimide; Oligomer; Phenylethynyl-terminated

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