基于常温无外压的转移印刷技术构筑半球状多级Ag基底

doi:10.7503/cjcu20170340

高等学校化学学报 ›› 2017, Vol. 38 ›› Issue (10): 1719.doi: 10.7503/cjcu20170340

• 研究论文: 无机化学 • 上一篇下一篇

基于常温无外压的转移印刷技术构筑半球状多级Ag基底

石刚¹(), 白绘宇¹, 王利魁¹, 桑欣欣¹, 杨井国¹, 倪才华¹, 李赢²()

1. 江南大学合成与生物胶体教育部重点实验室, 化学与材料工程学院, 无锡 214122
2. 江南大学粮食发酵工艺与技术国家工程实验室, 无锡 214122

收稿日期:2017-06-01 出版日期:2017-10-10 发布日期:2017-09-21
作者简介:联系人简介: 石刚, 男, 博士, 副教授, 主要从事界面微纳米加工研究. E-mail:shigang0720@126.com ;李赢, 女, 博士, 副教授, 主要从事有序界面材料研究. E-mail:lyjnu1984@163.com
基金资助:
国家自然科学基金(批准号: 21401079, 21671081)、江苏省自然科学基金(批准号: BK20140158)和中央高校基本科研业务费专项资金(批准号: JUSRP51626B)资助

Fabrication of Hierarchical Hemisphere Ag Substrate Using Transfer Imprinting with No Pressure Under Ambient Temperature^†

SHI Gang^1,^*(), BAI Huiyu¹, WANG Likui¹, SANG Xinxin¹, YANG Jingguo¹, NI Caihua¹, LI Ying^2,^*()

1. Key Laboratory of Synthetic and Biological Colloids, Ministry of Education, School of Chemical and Material Engineering,2. National Engineering Laboratory for Cereal Fermentation Technology, Jiangnan University, Wuxi 214122, China

Received:2017-06-01 Online:2017-10-10 Published:2017-09-21
Contact: SHI Gang,LI Ying E-mail:shigang0720@126.com;lyjnu1984@163.com
Supported by:
† Supported by the National Natural Science Foundation of China(Nos.21401079, 21671081), the Natural Science Foundation of Jiangsa Province, China(No.BK20140158) and the Fundametal Research Funds for the Central Universities, China(No.JOSRP51626B)

摘要/Abstract

摘要：

基于自组装技术制备了3种不同粒径的聚苯乙烯微球阵列, 并翻制了与微球阵列互补的软模板. 基于室温无外压的转移印刷技术制备了聚甲基丙烯酸甲酯半球形微纳阵列, 然后基于原位光还原技术在聚甲基丙烯酸甲酯半球表面制备Ag纳米颗粒, 构筑了拉曼增强的半球状多级Ag基底. 转移印刷技术的关键是利用软模板自身的低表面能和表面羟基化的图案化材料与亲水基底界面间的氢键作用力.

关键词: 转移印刷, 室温无外压, Ag基底, 多级结构

Abstract:

PS microsphere arrays with three kinds of particle sizes, which were used to make soft templates, were fabricated by self-assembling. Then, the polymethyl methacrylate(PMMA) hemispherical arrays were transferred from the soft template onto the substrate under ambient temperature with no pressure. Ag nanoparticles were formed by photo-reduction on the surface of hemispherical arrays, which performed surface enhanced Raman scattering. The key to this successful transfer imprinting is that the low surface energy of soft template and the hydrogen bond of the interface between PMMA and the substrate.

Key words: Transfer imprinting, Ambient temperature and no pressure, Silver substrate, Hierarchical structure

中图分类号:

O614.1

TrendMD:

石刚, 白绘宇, 王利魁, 桑欣欣, 杨井国, 倪才华, 李赢. 基于常温无外压的转移印刷技术构筑半球状多级Ag基底. 高等学校化学学报, 2017, 38(10): 1719.

SHI Gang, BAI Huiyu, WANG Likui, SANG Xinxin, YANG Jingguo, NI Caihua, LI Ying. Fabrication of Hierarchical Hemisphere Ag Substrate Using Transfer Imprinting with No Pressure Under Ambient Temperature^†. Chem. J. Chinese Universities, 2017, 38(10): 1719.

图/表 6

Scheme 1 Fabrication of Ag substrate with hierarchical hemisphere using transfer imprinting

Fig.1 SEM images of self-assembled PS microspheres with diametes of 500 nm(A), 1080 nm(B) and 1500 nm(C)

Fig.2 AFM images of PDMS molds fabricated by PS microspheres of different sizes(A) 500 nm; (B) 1080 nm; (C) 1500 nm.

Fig.3 SEM images of PMMA patterns imprinted by PS microspheres of different sizes(A) 500 nm; (B) 1080 nm; (C) 1500 nm.

Fig.4 Reflectance spectra of PMMA hemispherical arrays and Si wafera. Si; b. 500 nm; c. 1080 nm; d. 1500 nm.

Fig.5 Raman spectra of Ag on the hierarchical hemisphere(a) and on flat Si wafer(b)

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基于常温无外压的转移印刷技术构筑半球状多级Ag基底

Fabrication of Hierarchical Hemisphere Ag Substrate Using Transfer Imprinting with No Pressure Under Ambient Temperature^†

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基于常温无外压的转移印刷技术构筑半球状多级Ag基底

Fabrication of Hierarchical Hemisphere Ag Substrate Using Transfer Imprinting with No Pressure Under Ambient Temperature†

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Fabrication of Hierarchical Hemisphere Ag Substrate Using Transfer Imprinting with No Pressure Under Ambient Temperature^†