协同添加剂对电子电镀铜成核及镀层形貌与结构的影响机制
金磊, 王赵云, 杨防祖, 詹东平
Influence Mechanism of Synergistic Additives on the Nucleation and Coating Morphology and Structure of Copper Electronic Plating
JIN Lei, WANG Zhaoyun, YANG Fangzu, ZHAN Dongping
高等学校化学学报
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2024, (8): 20240146
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DOI: 10.7503/cjcu20240146
