高等学校化学学报

高等学校化学学报 ›› 1981, Vol. 2 ›› Issue (3): 285.

• 论文 • 上一篇    下一篇

Zn2+-HEDP-CO32-体系镀锌机理的研究(Ⅰ)——放电混合配体络离子的组成和第二配体CO32-的作用

方景礼1, 马辛卯2, 陆渭珍2   

  1. 1. 南京大学络合物化学研究所;
    2. 南京邮电518厂
  • 收稿日期:1980-08-05 出版日期:1981-08-24 发布日期:1981-08-24

A STUDY OF MECHANISM OF ZINC DEPOSITION IN Zn2+-HEDP-CO32- SYSTEM OF ELECTROPLATING-Ⅰ-COMPOSITION OF THE MIXED COMPLEX AND ACTION OF CO32-

Fang Jingli1, Ma Sinmao2, Lu Weizhen2   

  1. Coordination Chemistry Research Institute, Nanjing University, Nanjing
  • Received:1980-08-05 Online:1981-08-24 Published:1981-08-24

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摘要： 本文采用化学分析、红外光谱和电导滴定等方法研究了镀锌液中络离子的组成,得出镀液中存在的是[Zn(HL)(CO3)2]6-型混合配体络离子。此外,还研究了第二配体CO32-对镀液电化学性能的影响。结果表明,CO32-对于镀液的稳定、锌阳极的溶解以及镀液的阴极极化、分散能力和深镀能力的改善都起了重要作用,是镀液中不可缺少的主要络合剂之一。利用从镀液中分离出的固体络合物进行电镀,效果和镀液类似,从而推断镀液中放电的络离子即镀液中主要存在的络离子[Zn(HL)(CO3)2]6-。

Abstract: 1-Hydroxyethylidenediphosphonic acid (HEDP, HSL) has been used in zinc plating, but no information of its mechanism of deposition has been reported. The composition of the mixed complex in plating solution was determined by chemical analysis,IR spectra and conductometric titration.The results showed that the composition corresponded to K6[Zn(HL) (CO3)2].Effects of the second ligand CO32-on electrochemical behavior of plating solution has been investigated. The results indicate that the CO32-has an important action on stability of the plating solution, dissolution of anode, polarization of cathode and throwing and covering power of solution.Effect of the form of mixed complexes on electrodeposition has been discussed. Restriction of application in determining electrodeposited complex ion on cathode by method of exchange current density has also been discussed.

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