Effects of Surface Modification Strategies of Spherical Silica Particles on Properties of Epoxy Resin Composites for Electronic Packaging
ZHANG Lili, HU Haijun, LI Houwen, NIE Xingcheng, LI Bin, ZHANG Hailin, HU Qiaoju, ZHENG Dezhou, ZHANG Gouqing, JIN Jingfeng, LIU Wenxing, GAO Changyou
Chem. J. Chinese Universities
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0, (): 20250145
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DOI: 10.7503/cjcu20250145
