Chem. J. Chinese Universities ›› 2006, Vol. 27 ›› Issue (2): 372.

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Properties of a Novel Phenoxy Resin Containing Biphenyl Groups

CA Gong-Chi, NA Hui   

  1. Alan G. MacDiarmid Institiute, College of Chemistry, Jilin University, Changchun 130012, China
  • Received:2005-02-21 Online:2006-02-10 Published:2006-02-10
  • About author:NA Hui,E-mail: huina@jlu.edu.cn

Abstract:

Abstract A kind of novel phenoxy resin derived from 3,3′,5,5′-tetramethyl-4,4′-dihydroxybiphenyl and the epichlorohydrin was synthesized with catalyst and dispersant. FTIR and 1H NMR spectra were performed to characterize the structure of the resin. The analysis results indicate that the structure answers our design. In addition, the   thermal properties of the resin were studied by DMA and TGA analysis. According to these results, due to the molecular structure containing biphenyl groups in the resin the conformational entropy of chain segment of the polymer depressed effectively and the  Tg increased. The resin characterized in the article also has adequate physical property and good solubility in some solvents.

Key words: KeywordsPhenoxy resin; 3,3′,5,5′-tetramethyl-4,4′-dihydroxybiphenyl ; Thermal property

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