Abstract:

RCA (Radio Corporation of America) cleaning has been the important and critical step in semiconductor manufacturing for more than 30 years^[1]. As the electronics devices are shrinking and gate oxide is getting thinner, stringent requirements on metallic impurities,organic contamination and surface roughness on silicon wafer after wet chemical cleaning have attracted more attention in the mechanism of wet etching processes on Si(111) and Si(100) surfaces^[2=11]. In the past few years wet chemical and electrochemical etching of Si(110) in NH₄F solutions has been studied by using scanning tunneling microscopy (STM)^[12] and attenuated total reflection Fourier transform infrared spectroscopy (ATR-FTIR)^[13-14]. In the present work, we extend our study to Si(110) surface in NH₄F/HCl mixtures by using polarized attenuated total reflection FTIR (ATR-FTIR). We have compared the ex-situ ATR-FTIR results on Si(110) in various NH₄F/HCl solutions using Ge prism. Effects of potential on hydrogen-terminated structures on Si(110) surfaces have been investigated by employing in-situ electrochemical ATR-FTIR with double side polished single crystal silicon as a prism. Our ATR-FTIR spectra are correlated with the results obtained with in-situ STM.