Chem. J. Chinese Universities ›› 1984, Vol. 5 ›› Issue (3): 421.
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Huang Jifu1, Wang Ueren1, Zhang Baolong1, Lu Yanling1, Hu Xiangwei1, Chen Guohua1, Yang Biao2, Liu Zhixin2
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Abstract: Spline simulation function has been applied to the study of the curing kinetics of epoxy resins and better accuracy of DSC simulated curves and more satisfactory kinetic parameters were obtained. The values of apparent activation energies, E, obtained from the isothermal curves were in the range of 10-12 kcal/mol, which agreed with the results of our previous TBAexperiment as well as those reported in the literature. Similar results (apparent activation energy Eand reaction order n) were observed from the dynamic DSCexperimental curves of the reaction systems.
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Huang Jifu, Wang Ueren, Zhang Baolong, Lu Yanling, Hu Xiangwei, Chen Guohua, Yang Biao, Liu Zhixin. A STUDY OF THE CURING KINETICS OF EPOXY RESINS BY SPLINE SIMULATION FUNCTION[J]. Chem. J. Chinese Universities, 1984, 5(3): 421.
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http://www.cjcu.jlu.edu.cn/EN/Y1984/V5/I3/421