High-frequency Specific Dielectric Properties of Carbon Black Filled Rubber Composites†

doi:10.7503/cjcu20180141

Abstract

Abstract:

In order to develop high-performance microwave human tissue-equivalent materials,it is a great challenge to endow polymer composites with tunable high-frequency specific dielectric properties. The effects of carbon black(CB) particle size, specific surface area, structure and the CB-matrix interaction on electrical conductivity and high-frequency specific dielectric properties of rubber composites were systematically investigated in this paper. The results show that the percolation threshold is high in CB-filled strong polar acrylic rubber(AR) composites, and the addition of CB can enhance the low-frequency dielectric constant due to strong CB-AR interfacial interactions. However, the dielectric properties decay quickly with increasing frequency, resulting from the strong interfacial polarization. While in the case of weak polar(nonpolar) silicone rubber composites, the dielectric properties at high frequencies decay relatively slowly with increasing frequency. Although CB particles with big size, small specific surface area and low structure are not conducive to form the percolation network, the high-frequency dielectric properties attenuate slowly with an increase of frequency. The results reveal that it is possible to simulate the broadband dielectric properties of human muscle and fat with CB-filled silicone rubber composites.

Key words: Rubber polarity, Carbon black filled rubber composite, Percolation threshold, High-frequency dielectric property

CLC Number:

O631

TrendMD:

WANG Wenqi,LIN Yu,WU Guozhang. High-frequency Specific Dielectric Properties of Carbon Black Filled Rubber Composites^†[J]. Chem. J. Chinese Universities, 2018, 39(10): 2320.

Figures/Tables 10

Table 1 Detailed information of different types of carbon blacks

Carbon black	Size/nm	N₂ specific area/(m²·g^-1)	DBP absorption/(cm³·100 g^-1)	Oxygen content(%)
Acetylene black(AB)	42	75	298	3.0
VXC72R(VB)	30	254	178	0.7
N990(NB)	280	7—12	34—44	0.5

Fig.1 Volume resistivity versus filler content of AR32(A) and silicone rubber(B) composites filled with different types of carbon blacks CB: a. AB; b. VB; c. NB.

Fig.2 SEM images of AR-AB-16.7%(A), AR-AB-23.1%(B), AR-AB-28.6%(C), AR-NB-66.7%(D), AR-NB-71.4%(E) and AR-NB-75%(F)

Fig.3 SEM images of SR-AB-5%(A), SR-AB-10%(B), SR-AB-15%(C), SR-NB-30%(D), SR-NB-50%(E) and SR-NB-70%(F)

Fig.4 Frequency dependence of dielectric constant(ε’) for AB filled AR32(A) and silicone rubber(B) composites

Fig.5 Frequency dependence of dielectric loss(ε″) for AB filled AR32(A) and silicone rubber(B) composites

Fig.6 Frequency dependence of dielectric constant for VB(A) and NB(B) filled silicone rubber composites

Fig.7 Frequency dependence of dielectric loss for VB(A) and NB(B) filled silicone rubber composites

Fig.8 Dielectric constant(A) and dielectric loss(B) for AB filled silicone rubber composites as a comparison with the dielectric properties of muscle and fat according to references[29,30]

Fig.9 Dielectric constant(A) and dielectric loss(B) of NB filled silicone rubber composites as a comparison with the dielectric properties of muscle and fat according to references[29,30]

References 30

[1]	Chou C., Chen G., Guy A., Luk K., Bioelectromagnetics, 1984, 5, 435—441
[2]	Ito K., Furuya K., Okano Y., Hamada L., Electr. Commun. Jpn., 2001, 84(4), 67—69
[3]	Nikawa Y., Chino M., Kikuchi K., IEEE Trans. Microw. Theory Tech., 1996, 44(10), 1949—1952
[4]	Moon K.S., Choi H. D., Lee A. K., Cho K. Y., Yoon H. G., Suh K. S., J. Appl. Polym. Sci., 2000, 77, 1294—1302
[5]	Youngs I.J., Treen A. S., Fixter G., Holden S., IEE Proc. Sci. Meas. Technol., 2002, 149(6), 323—328
[6]	Garrett J., Fear E., IEEE Antennas Wirel. Propag. Lett., 2014, 13, 599—602
[7]	Al-Saleh M.H., Saadeh W. H., Sundararaj U., Carbon, 2013, 60, 146—156
[8]	Brosseau C., Boulic F., Queffelec P., Bourbigot C., Le Mest Y., Loaec J., J. Appl. Phys., 1997, 81(2), 882—890
[9]	Foulger S.H., J. Appl. Polym. Sci., 1999, 72(12), 1573—1582
[10]	Liu X.X., Zhang Z. Y., Wu Y. P., Compos. Part B: Eng., 2011, 42(2), 326—329
[11]	Stoyanov H., Mc Carthy D., Kollosche M., Kofod G., Appl. Phys. Lett., 2009, 94, 232905
[12]	Tang Y.C., Liu X., Kong L. F., Wu G. Z., Polym. Mater. Sci. Eng., 2012, 28(7), 72—74
	(倘余昌, 刘星, 孔兰芳, 吴国章. 高分子材料科学与工程, 2012, 28(7), 72—74)
[13]	Dang Z.M., Yuan J. K., Zha J. W., Zhou T., Li S. T., Hu G. H., Prog. Mater. Sci., 2012, 57(4), 660—723
[14]	Stauffer D., Aharony A., Introduction to Percolation Theory, Taylor & Francis Ltd., London, 1985, 89—94
[15]	Cao M.S., Song W. L., Hou Z. L., Wen B., Yuan J., Carbon, 2010, 48, 788—796
[16]	Cao M.S., Yang J., Song W. L., Zhang D. Q., Wen B., Jin H. B., Hou Z. L., Yuan J., ACS Appl. Mater.Interfaces, 2012, 4, 6949—6956
[17]	Wen B., Cao M.S., Lu M. M., Cao W. Q., Shi H. L., Liu J., Wang X. X., Jin H. B., Fang X. Y., Wang W. Z., Yuan J., Adv. Mater., 2014, 26, 3484—3489
[18]	Jonscher A.K., IEEE Trans. Electr. Insul., 1992, 27(3), 407—421
[19]	Chung K.T., Sabo A., Pica A. P., J. Appl. Phys., 1982, 53, 6867—6879
[20]	Salaeh S., Nakason C., Polym. Composite, 2012, 33(4), 489—500
[21]	Wu G.Z., Asai S., Sumita M., Macromolecules, 2002, 35, 945—951
[22]	Le H.H., Pham T., Henning S., Klehm J., Wießner S., Stockelhuber K. W., Das A., Hoang X. T., Do Q. K., Wu M., Vennemann N., Heinrich G., Radusch H. J., Polymer, 2015, 73, 111—121
[23]	Wang Z., Zhao G.L., J. Mater. Chem.C, 2014, 2(44), 9406—9417
[24]	Li G., Xie T.S., Yang S. L., Jin J. H., Jiang J. M., J. Phys. Chem.C, 2012, 116, 9196—9201
[25]	Sun K., Xie P.T., Wang Z. Y., Su T. M., Shao Q., Ryu J. E., Zhang X. H., Guo J., Shankar A., Li J. F., Fan R. H., Cao D. P., Polymer, 2017, 125, 50—57
[26]	Cheng C., Fan R., Ren Y., Ding T., Qian L., Guo J., Li X., An L., Lei Y., Yin Y., Nanoscale, 2017, 9, 5779—5787
[27]	Wang Z., Zhou W., Dong L., Sui X., Cai H., Zuo J., Chen Q., J. Alloys Compd., 2016, 682, 738—745
[28]	Otero-Navas I., Arjmand M., Sundararaj U., Polymer, 2017, 114, 122—134
[29]	Stuchly M. A., Stuchly S. S., J. Microwave Power E. E., 1989, 15(1), 19—26
[30]	Johnson C.C., Guy A. W., Proc.IEEE, 1972, 60(6), 692—718