CJCU
Effects of Additive on the Electrodeposition and Coating Structure in a Novel System of Electronic Copper Electroplating
LI Weiqing, JIN Lei, YANG Jiaqiang, Wang Zhaoyun, YANG Fangzu, ZHAN Dongping, TIAN Zhongqun
Chem. J. Chinese Universities . 2021, (9): 2919 -2925 .  DOI: 10.7503/cjcu20210225