CJCU
Thermal Expansion Behavior of Amide-containing Polyimide Films with Ultralow Thermal Expansion Coefficient †
BAI Lan, ZHAI Lei, WANG Changou, HE Minhui, MO Song, FAN Lin
Chem. J. Chinese Universities . 2020, (4): 795 -802 .  DOI: 10.7503/cjcu20190563