Chem. J. Chinese Universities ›› 2025, Vol. 46 ›› Issue (3): 20240470.doi: 10.7503/cjcu20240470

• Physical Chemistry • Previous Articles     Next Articles

Controllable Preparation and Carrier Mobility Regulation of Cu-THQ Thin Films

WANG Longsheng, LI Zhaohui, HE Xuan, LI Weixin, CHEN Hui, WANG Daheng, FANG Wei, DU Xing(), ZHAO Lei()   

  1. State Key Laboratory of Advanced Refractories,Wuhan University of Science and Technology,Wuhan 430081,China
  • Received:2024-10-18 Online:2025-03-10 Published:2024-12-17
  • Contact: DU Xing E-mail:duxing@wust.edu.cn;zhaolei@wust.edu.cn
  • Supported by:
    the National Natural Science Foundation of China(22105151);the Key Research Program of Hubei Province, China(2022BAA094);the Natural Science Foundation of Hubei Province, China(2024AFB836)

Abstract:

In this paper, Cu-THQ(THQ=tetrahydroxy-1,4-benzoquinone) films with different surface roughness were prepared by chemical vapour deposition(CVD). The intrinsic relationship between the surface roughness, the degree of molecular π-π stacking and the carrier mobility for the Cu-THQ films was investigated. Meanwhile, the regulation mechanism of the temperature on the carrier mobility of Cu-THQ films was explored in the CVD growth process. The results show that a large number of unsaturated coordination sites exist in the metal ions of the Cu-THQ-3 film near the heat source, which leads to the weakening of the interlayer charge repulsion and the formation of tighter π-π stacking. As a result, the Cu-THQ-3 film exhibits higher surface roughness and carrier mobility, with the Hall effect mobility reaching 4.10 cm2∙V-1∙s-1. The temperature regulation of carrier mobility for the film is achieved by controlling the distance between the substrate and the heat source, providing a new opportunity for its implementation in practical devices.

Key words: Conductive metal-organic framework, Chemical vapour deposition, Coordination mode, π-π Stacking, Hall effect carrier mobility

CLC Number: 

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